Laser Drilling on silicon carbide

I am trying to simulate material removal during percussion laser drilling. The laser(Heat) source must move along the depth of the hole as the material is removed. The material needs to be removed as it reaches melting temperature.
How can this be simulated? Can a moving Mesh boundary be incorporated?

Also there is a model for trepan drilling where laser pulse is moved in a circular curve. Can this be used to simulate moving laser beam along depth?